SK Hynix has announced that it is ready to test its latest form of High Bandwidth Memory (or HBM) for its customers in high-end applications such as research or artificial intelligence. Thanks to the new manufacturing technology used in its manufacture, the HBM3E can keep the temperature up to 10% lower. It is also compatible with systems already configured to use the older HBM3.
NVIDIA's hyperscale and HPC computing division is responsible for the company's needs to enhance demanding applications, from "weather forecasting to energy exploration to computational fluid mechanics and life sciences. with your artificial intelligence. According to group vice president Ian Buck, it will be possible together." with SK Hynix?will deal with HBM3E (or extended HBM3) in the future.
New iterative update of "The highest specification DRAM currently available for AI applications"; has shown it can handle data “up to 1.15 terabytes”; (TB or more than 230 FHD movies of 5GB each) per second, according to SK Hynix. It also includes a "10%" discount on the upgrade related to "Heat Dissipation"; (though not shown) using the latest Mass Reflow Molded Fill (MR-MUF) process technology.
SK Hynix'039; The HBM3E is also backward compatible, allowing it to act as a direct RAM upgrade on a system with CPUs and GPUs that could previously be configured to use the HBM3. The company anticipates that it could start mass production in the first half of 2024 (H1 2024), but is currently in the sample phase with customers such as NVIDIA.
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